Critères de l'offre
Métiers :
- Technical Lead engineer
Expérience min :
- 6 à 20 ans
Secteur :
- Cabinets de conseils
Diplômes :
- Diplôme de grande école d'ingénieur
- + 1 diplôme
Compétences :
- Anglais
Lieux :
- Paris (75)
Conditions :
- CDI
- Temps Plein
Description du poste
IC Package Technical Lead (W/M)
- Contract Type: Full-time (CDI)
- Location: Paris
- Ref: 1287
- Contact: ******************
Recruiting Company:
French fabless semiconductor manufacturer specialized in the design and marketing of highly integrated, mixed-signal semiconductor products for markets demanding wideband and low power analog-to-digital, digital-to-analog conversion.
Role:
A dynamic and experienced IC package technical lead to drive all package related activities with our assembly partners, including the choice and materials development, to create outstanding products in a dynamic environment.
Responsibilities:
- Serve as focal point for all packaging-related matters.
- Collaborate closely with assembly centers and the design/R&D team to define and specify IC packages.
- Work with the IC design team to define and/or design reliable BGA package substrates using CAD tools.
- Prepare documentation for BGA substrate design approval and first procurement under QA policy.
- Lead the selection of advanced packaging materials with standard and innovative solutions to meet total product package performance requirements across product application domains.
- Conduct feasibility studies for early assessment of substrate technology and electrical performances.
- Collaborate with assembly center R&D teams for continuous improvement of design performance.
- Execute and/or drive Electrical, Thermal and Mechanical Modeling in collaboration with assembly partners.
- Contribute to the integration of solutions into customer applications on packaging-related aspects and the implementation of thermal dissipation systems.
Requirements:
- You hold an MSc in Electrical Engineering or equivalent, with over 5 years hands-on experience in defining, selecting, and qualifying IC packages, strongly understanding of IC package assembly development process.
- You demonstrate expertise in high-performance Flip-Chip BGA packaging for large-scale, high-speed/power IC.
- You have experience evaluating impact of packaging on PCB design, board, system integration, high-speed, RF.
- You excel at system-level thermal dissipation technologies: through board, heat spreader, heat sink, fan.
- Your pluses: thermal simulation, RF, die-to-die interconnect Technologies, design tools, French language.
- You demonstrate analytical and problem-solving skills, are a team player with a critical attitude and sense of initiative, communicate fluently in oral and written English, are ready to travel occasionally to assembly lines.
Education:
BAC+5, Master's Degree
RHESO.TECH, a specialized recruitment agency
https://www.rheso.tech/
Key words: IC, Package, IC Package, Assembly, Design, BGA, CAD, PCB, RF
Référence : 1287